Project Details
- Name : Seneca, IL – 2026 Chip Seal
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Description :
The work to be performed consists of class A2 chip seal, spray patching, fog seal, and all incidental and collateral work necessary to complete the improvement.
BIDDERS ARE ADVISED TO CHECK THE WEBSITE FREQUENTLY FOR ISSUED ADDENDA.
Bid Date :
July 23, 2026 10:15 am
Bid Location :
Village of Seneca Village Hall, 340 N. Cash Street, Seneca, IL 61360
Pre-Bid Meeting Location :
Project Contact
- Person Name :Casey McCollom
- Phone Number :(815)942-1402
- Email Address :[email protected]
Project Documents :
Bid Docs :
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Project Specs :
Downloads :
Plan Holders List :
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Plan Holders List
| Company | Name | Phone | Address | Action |
|---|---|---|---|---|
| ePlan | Amber Cox | 573-447-7130 | Columbia Missouri 65203 | View Profile |
| Southern Illinois Builders Association | Stephanie Foster | 618-624-9055 | O'Fallon Illinois 62269 | View Profile |
| Deltek | Source Management | 800-456-2009 | Herndon Virginia 20171-6008 | View Profile |
| DataBid | Julie Dustin | 888-929-3282 | Newtown Pennsylvania 18940 | View Profile |
| Blackridge Research & consulting | Venkatesh Siva | 091-799-3746 | Peoria Illinois 61615 | View Profile |
| Angie Macdonald | View Profile | |||
| Construct Connect | Rhea Pagador | 323-602-5079 | Norcross Georgia 30092 | View Profile |