Project Details

  • Name : Seneca, IL – 2026 Chip Seal
  • Description :

    The work to be performed consists of class A2 chip seal, spray patching, fog seal, and all incidental and collateral work necessary to complete the improvement.

    BIDDERS ARE ADVISED TO CHECK THE WEBSITE FREQUENTLY FOR ISSUED ADDENDA.

Bid Date :

July 23, 2026 10:15 am

Bid Location :

Village of Seneca Village Hall, 340 N. Cash Street, Seneca, IL 61360

Pre-Bid Meeting Location :

Project Contact

  • Person Name :Casey McCollom
  • Phone Number :(815)942-1402
  • [email protected]

Project Documents :

Bid Docs :

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Project Specs :
Plan Holders List :

Plan Holders List

Company Name Phone Address Action
ePlanAmber Cox573-447-7130 Columbia Missouri 65203View Profile
Southern Illinois Builders AssociationStephanie Foster618-624-9055 O'Fallon Illinois 62269View Profile
DeltekSource Management800-456-2009 Herndon Virginia 20171-6008View Profile
DataBidJulie Dustin888-929-3282 Newtown Pennsylvania 18940View Profile
Blackridge Research & consultingVenkatesh Siva091-799-3746 Peoria Illinois 61615View Profile
Angie Macdonald View Profile
Construct ConnectRhea Pagador323-602-5079 Norcross Georgia 30092View Profile

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